Metallic impurities are removed as a preventive measure or as part of the production or rework process. It is a liquid additive added to bright nickel plating solution to eliminate the defects caused by copper, zinc, iron and organic contamination.
NP 1090
Physical Properties: NP 1090: Liquid
Description
NP 1090 is a liquid additive to overcome iron contamination in bright nickel electroplating solutions.
NP 1090 forms a soluble complex with iron (III), preventing its precipitation and allowing it to be reduced to the ferrous form and, finally, plated out in the deposit during production.
NP 1099
COPPER, ZINC AND ORGANIC REDUCER FOR NICKEL PLATING SOLUTIONS
Physical Properties: NP 1099 : Liquid
Description
NP 1099 is a liquid additive to eliminate the defects caused by copper, zinc and organic contamination in bright nickel plating solution.
NP 1099 also removes deposit defects, such as low current density dark staining or accidental brightener overdosing, and gives cleaner and brighter recesses.